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S25FL256LAGNFB010
Infineon Technologies AG
WSON EP-8
23+
欧盟RoHS指令 | Compliant |
美国出口管制分类ECCN编码 | 3A991b.1.a. |
环保无铅 | Active |
美国海关商品代码 | 8542.32.00.71 |
Automotive | Yes |
PPAP | Yes |
Cell Type | NOR |
Chip Density (bit) | 256M |
Architecture | Sectored |
Boot Block | Yes |
Block Organization | Symmetrical |
Location of Boot Block | Bottom|Top |
Address Bus Width (bit) | 32 |
Sector Size | 4Kbyte x 8192 |
Page Size | 256byte |
Number of Bits/Word (bit) | 1/2/4 |
Number of Words | 256M/128M/64M |
Programmability | Yes |
Timing Type | Synchronous |
Max. Access Time (ns) | 8 |
Maximum Erase Time (S) | 360/Chip |
Maximum Programming Time (ms) | 1.2/Page |
Process Technology | 65nm, Floating Gate |
Interface Type | Serial (SPI, Dual SPI, Quad SPI) |
Minimum Operating Supply Voltage (V) | 2.7 |
Maximum Operating Frequency (MHz) | 133 |
Typical Operating Supply Voltage (V) | 3|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Programming Voltage (V) | 2.7 to 3.6 |
Operating Current (mA) | 35 |
Program Current (mA) | 50 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 105 |
Supplier Temperature Grade | Automotive |
Command Compatible | Yes |
ECC Support | No |
Support of Page Mode | No |
Minimum Endurance (Cycles) | 100000 |
Packaging | Tray |
Mounting | Surface Mount |
Package Height | 0.73 |
Package Width | 6 |
Package Length | 5 |
PCB changed | 8 |
Supplier Package | WSON EP |
Pin Count | 8 |